Unraveling Slurry Chemistry/Nanoparticle/Polymeric Membrane Adsorption Relevant to Cu Chemical Mechanical Planarization (CMP) Filtration Applications

Overview of attention for article published in ECS Journal of Solid State Science and Technology, January 2019

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In the top 25% of all research outputs scored by Altmetric
Among the highest-scoring outputs from this source (#11 of 479)
High Attention Score compared to outputs of the same age (90th percentile)
High Attention Score compared to outputs of the same age and source (92nd percentile)

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So far, Dimensions has found 2 publications that cite this research output.

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The most recent citing publications are shown below. View all 2 publications that cite this research output on Dimensions.

Probing the Mechanisms of Metal CMP Using Tribo-Electroanalytical Measurements: Results for a Copper/Malonate System

Article in ECS Journal of Solid State Science and Technology (March 2021)

Synergistic Effect of Pad “Macroporous-Reactors” on Passivation Mechanisms to Modulate Cu Chemical Mechanical Planarization (CMP) Performance

Article in ECS Journal of Solid State Science and Technology (January 2020)